Single-head dual-platform switching processing method, compared to single-platform equipment, saves board changeover time, enables continuous laser operation, and significantly boosts production efficiency. This specialised equipment is tailored for PCB/FPC processing, replacing traditional single-platform cutters.

　　Working Principle: The single-head dual-platform switching processing method substantially boosts production efficiency, being a dedicated device tailored for FPC and PCB processing.

Quality and Efficiency: Performs block-by-block, layer-by-layer cutting, or cuts designated blocks/selected areas directly into shape. Cutting edges are neat, rounded, smooth, burr-free, and free from adhesive overflow. Products can be arranged in a matrix for automatic positioning and cutting, particularly suited for intricate, challenging, and complex patterned shapes.

　　Wide Applications: Efficient, rapid FPC/PCB contour cutting, drilling, cover film windowing, fingerprint recognition chip cutting, TF memory card separation, mobile camera module cutting, and more.

　　Motion System: Combines high-precision, low-drift galvanometers with rapid linear motor platforms to maintain micron-level accuracy during high-speed cutting.

Vision System: Utilises high-resolution branded CCD cameras and lenses for precise automatic positioning and focusing. Features a proprietary vision model capture module suitable for acquiring arbitrary feature points.

　　Dust Extraction System: The suction system eliminates all cutting fumes, preventing harm to operators and environmental pollution.

Calibration System: Automated galvo mirror calibration and autofocus achieve full automation. Laser displacement sensors automatically adjust the focal point to the work surface height, enabling rapid alignment for time and labour savings.