Core processes serving next-generation display technologies such as OLED, Mini/Micro LED.
Flexible OLED Display Solutions: UV picosecond lasers represent the sole viable option for cutting flexible OLED multilayer composite materials, effectively resolving issues such as screen yellowing, delamination, and cracking associated with conventional cutting methods.
Mini/Micro LED Mass Transfer Solutions: Ultrafast lasers are employed for glass/sapphire substrate cutting, alongside critical laser lift-off (LLO) and laser lift transfer (LIFT) processes, enabling the efficient and precise assembly of millions of micrometre-scale LED chips.
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